2108 High temperature resistant 200℃ chemical resistant low expansion epoxy structural adhesive

Description:

Wellmid 2108 is a multi-purpose, two-component epoxy adhesive. After basic curing at room temperature, it can be recured at high temperature for better performance. It has high strength, good toughness, strong rigidity and high temperature resistance up to 200℃ . Used for bonding metal, composite materials and most common materials. It has good weather resistance, excellent water and chemical

resistance, and good vibration resistance. Applications include electronic components, electrical assembly, equipment parts, composite parts and other structural parts that need to withstand high temperature and dynamic load bonding.

Key properties：

● The shear modulus more than 35Mpa when the high temperature is 200℃

● Non-flowing thixotropic type caulking adhesive, easy to operate and use

● Excellent resistance to most chemicals

● Can be bonded to most materials, good weather resistance and wa ter resistance

● Excellent balance between rigid strength and toughness, good dy namic load performance

● Mix ratio by volume：100:50 / Mix ratio by weight：100:50

Pretreatment：

The strength and durability of a bonded joint are dependant on proper treatment of the surfaces to be bonded. At the very least, joint surfaces should be cleaned with a good degreasing agent such as acetone, alcohol or other proprietary degreasing agents in order to remove all traces of oil, grease and dirt. The strongest and most durable joints are obtained by either mechanically abrading or chemically etching (“pickling”) the degreased surfaces. Abrading should be followed by a second degreasing treatment.

Application of adhesive：

Wellmid 2108 AB must be thoroughly mixed in the corresponding proportion to achieve the best bonding effect.

Side-by-side cartridges and the static mixer can achieve better mixing results while increasing efficiency and reducing waste and pollution. The resin and hardener can be applied directly to the pretreated dry bonded surface through the mixer. A layer of 0.05-0.10mm thick adhesive layer can completely wet the adhesive surface, and give the adhesive with maximum shear strength. Too thick adhesive layer and too much glue around, and can not bring greater bonding strength to the adhesion.

Equipment maintenance：

All tools should be cleaned with hot water and soap before adhesives residues have had time to cure. The removal of cured residues is a difficult and time-consuming operation. If solvents such as acetone are used for cleaning, operatives should take the appropriate precautions and, in addition, avoid skin and eye contact. Used cartridges and mixers cannot be used again.

Curing Time and Temperature：

Wellmid 2108 can achieve a basic cured at room temperature and have a good strength.

However, due to the design of a medium high temperature post-cured acivtation program, The glue cannot be fully cured at below 60 ℃. It is recommended to cured at room temperature for 8-24 hours, and then recure at 150℃ for 20-30 minutes. 

Or refer to the above table to select the curing temperature and curing time suitable for the production process, so as to achieve the best performance of the product formulation design.

DIY workers mixing the glues on the plastic lid that comes with the tin can reduce pollution, and the glue remaining on the plastic lid can be easily removed after the gl ue has cured;

Side-by-side cartridges and the static mixer is suitable for co ntinuous production of the dispensing gun / machine, which can greatly improve production efficiency and reduce waste and pollution.

Storage and Packing：

Wellmid 2108 A and B must be stored at room temperature provided the components are stored in sealed containers. Avoid sunlight, the longest effective time of the product can be more than 36 months; The expiry date is indicated on the label.

Package: 2oz(56.7Grams) / 1.5Lb(681Grams) / 3kg Tin can sets; 50ml / 400ml Cartridge.