中文版
English
Description：
Wellmid 2110 is a lightweight, one-component, high-temperature curing thixotropic epoxy adhesive with high strength, good toughness, chemical resistance, insulation, and high temperature resistance up to 150°C. Suitable for bonding metal, glass, ceramics and hard composite plastics. It has very good weather resistance, resistance to a wide range of chemical media and solvents, water and moisture resistance, and good dynamic load performance.Application areas include the assembly of precision electronic industrial parts and the bonding of special industrial structural parts that require resistance to chemical media.
Key properties：
● Especially suitable for bonding metal, ceramics, glass, and h ard composite plastics
● Excellent resistance to water, chemicals and solvents
● Low shrinkage, good dynamic load performance, excellent fatig ue and crack resistance
● High dielectric strength and good insulation
● Strong adhesive with high shear and peel strength
●Can be used between -40~150℃
| Property | 2110 |
| Colour (visual) | Grey |
| Specific gravity | 1.10~1.15 |
| Viscosity at 23-25℃ | Thixotropy |
| Pot Life at 23-25℃ | 5 days |
Pretreatment
The strength and durability of a bonded joint are dependant on proper treatment of the surfaces to be bonded. At the very least, joint surfaces should be cleaned with a good degreasing agent such as acetone, alcohol or other proprietary degreasing agents in order to remove all traces of oil, grease and dirt. The strongest and most durable joints are obtained by either mechanically abrading or chemically etching (“pickling”) the degreased surfaces. Abrading should be followed by a second degreasing treatment.
Application of adhesive
Wellmid 2110 should be sealed and stored in a dry and cold environment at 3~6℃ When it's not in use.
When using, the product should be placed at room temperature for 1-2 hours to restore the normal state of the glue before construction. Wellmid 2110 can be applied directly to the pretreated dry bonded surface through the mixer. A layer of 0.03-0.05mm thick adhesive layer can completely wet the adhesive surface, and give the adhesive with maximum shear strength. Too thick adhesive layer and too much glue around, can not bring greater bonding strength to the adhesion.
Equipment maintenance
All tools should be cleaned with hot water and soap before adhesives residues have had time to cure. The removal of cured residues is a difficult and time-consuming operation. If solvents such as acetone are used for cleaning, operatives should take the appropriate precautions and, in addition, avoid skin and eye contact. Used cartridges and mixers cannot be used again.
Curing Time and Temperature：
| Curing temperature | 90℃ | 100℃ | 120℃ | 140℃ | 160℃ | 180℃ | 200℃ |
| Cure time to reach 50% shear strength | 4H | 3H | 60min | 35min | 15min | 5min | - |
| Cure time to reach 100% shear strength | - | - | 2H | 60min | 35min | 12min | - |
Or refer to the above table to select the curing temperature and curing time suitable for the production process,so as to achieve the best performance of the formula design of this product;
If curing in an open high-temperature environment such as a heating plate/sleeve, it is necessary to appropriately increase the curing temperature and prolong the curing time;
Syringe and needle is suitable for continuous construction of the dispensing gun / machine, which can greatly improve production efficiency and reduce waste and pollution.
Storage and Packing：
Wellmid 2110 should be sealed and stored in a dry and cold environment of -5~-20℃ When not in use, the longest effective time of the product can be more than 12 months; Store at room temperature for a maximum of 3 months. The expiry date is indicated on the label.
Package : 1oz Syringe.
