2121 Heat conduction explosion-proof epoxy adhesive

Description：

Wellmid2121 is a two-component, high-filling, high-temperature curing heat conductive epoxy resin adhesive with excellent chemical resistance, insulation performance and high temperature explosion-proof performance;

Use for explosion-proof encapsulation and insulation fixing of electronic components such as motors,in ductors, transformers, igniters, potential protectors, and coils; It can also be used for high-temperature structural bonding of composite materials, laminated materials, and metals.

Key properties：

● Excellent electrical insulation, heat conductivity and low thermal expansion coefficient

● After curing, it can withstand the working high temperature of 180℃ for a long time, and can withstand the high

temperature of 300℃ for a short time

● Excellent chemical resistance, burst resistance and high and low temperature cycle impact resistance

● Used for insulation packaging and explosion-proof of special motors, inductors, transformers, igniters, protectors and coils

● Used for structural bonding of thermosetting plastics, composite materials, magnetic materials and metals

● Mix ratio by volume：100:100 / Mix ratio by weight：100:110

Pretreatment：

The strength and durability of a bonded joint are dependant on proper treatment of the surfaces to be bonded. At the very least, joint surfaces should be cleaned with a good degreasing agent such as acetone, alcohol or other proprietary degreasing agents in order to remove all traces of oil, grease and dirt. The strongest and most durable joints are obtained by either mechanically abrading or chemically etching (“pickling”) the degreased surfaces. Abrading should be followed by a second degreasing treatment.

Application of adhesive：

Wellmid 2121 AB must be thoroughly mixed in the corresponding proportion to achieve the best bonding effect.

Side-by-side cartridges and the static mixer can achieve better mixing results while increasing efficiency and reducing waste and pollution. The resin and hardener can be applied directly to the pretreated dry bonded surface through the mixer. A layer of 0.05-0.10mm thick adhesive layer can completely wet the adhesive surface, and give the adhesive with maximum shear strength. Too thick adhesive layer and too much glue around, and can not bring greater bonding strength to the adhesion.

Equipment maintenance：

All tools should be cleaned with hot water and soap before adhesives residues have had time to cure. The removal of cured residues is a difficult and time-consuming operation. If solvents such as acetone are used for cleaning, operatives should take the appropriate precautions and, in addition, avoid skin and eye contact. Used cartridges and mixers cannot be used again.

Curing Time and Temperature：

Wellmid2121 may harden at a temperature of 90°C~120°C, but it ca nnot fully achieve the design performance of the product; The recommended curing scheme is: curing at 90°C for 3 hours, rising to 120°C for 1 hour, then raising to 150°C for 2-3 hours;

If it is used for bonding, the curing time may be shortened if the adhesive layer is thin; if it is used for encapsulation, please strictly ensure the curing temperature an d curing time if the adhesive layer is thicker;

There may be precipitation in this product. It is best to stir separately before mixing to eliminate precipitation. It is easier to stir in a water bath or bake at 40~60°C for 20~30 min utes.

Storage and Packing：

Wellmid 2121 A and B must be stored at room temperature provided the components are stored in sealed containers. Avoidsunlight, the longest effective time of the product can be more than 24 months; The expiry date is indicated on the label.

Package: 2LB(908Grems) / 2kg Tin can Sets.