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Description：
Wellmid2118 is a multi-purpose, single-component, high-temperature curing thixotropy epoxy adhesive, high strength, good toughness, insulation and high temperature resistance up to 150℃ . Suitable for bonding metals, magnetic materials, composite materials and most commonly used materials. It has good weather resistance, excellent water and chemical resistance, good vibration resistance. Application areas of bonding include electronic components, copper wire coils, electrical assembly, equipment parts, and motor magnetic assembly that need to withstand high temperatures and insulated structural parts.
Key properties：
● The strong adhesive has good dynamic load performance and shear and peel strength
● One-component non-flowing thixotropy adhesive for easy operation
● Excellent resistance to most chemicals
● Can be bonded to most materials, good weather resistance and wa ter resistance
● Excellent dielectric properties, especially used in electronic products
● High hardness, good wear resistance
| Property | 2118 |
| Colour (visual) | Grey |
| Specific gravity | 1.45 |
| Viscosity at 23-25℃ | Thixotropy |
| Pot Life at 23-25℃ | 5 days |
Pretreatment
The strength and durability of a bonded joint are dependant on proper treatment of the surfaces to be bonded. At the very least, joint surfaces should be cleaned with a good degreasing agent such as acetone, alcohol or other proprietary degreasing agents in order to remove all traces of oil, grease and dirt. The strongest and most durable joints are obtained by either mechanically abrading or chemically etching (“pickling”) the degreased surfaces. Abrading should be followed by a second degreasing treatment.
Application of adhesive
Wellmid 2118 should be sealed and stored in a dry and cold environment at 3~6℃ When it's not in use.
When using, the product should be placed at room temperature for 1-2 hours to restore the normal state of the glue before construction. Wellmid 2118 can be applied directly to the pretreated dry bonded surface through the mixer. A layer of 0.03-0.05mm thick adhesive layer can completely wet the adhesive surface, and give the adhesive with maximum shear strength. Too thick adhesive layer and too much glue around, can not bring greater bonding strength to the adhesion.
Equipment maintenance
All tools should be cleaned with hot water and soap before adhesives residues have had time to cure. The removal of cured residues is a difficult and time-consuming operation. If solvents such as acetone are used for cleaning, operatives should take the appropriate precautions and, in addition, avoid skin and eye contact. Used cartridges and mixers cannot be used again.
Curing Time and Temperature：
| Curing temperature | 100℃ | 120℃ | 140℃ | 160℃ | 180℃ | 200℃ |
| Cure time to reach 50% shear strength | 2H | 1H | 20min | 10min | 2min | 1min |
| Cure time to reach 100% shear strength | 4H | 2H | 40min | 20min | 5min | 3min |
Wellmid 2118 cannot be cured at room temperature; Extending the curing time below 100℃ may make the glue harden, but it can not completely cure and achieve the performance of the glue design; It is recommended to bake at 120℃ for 120 minutes; Or refer to the above table, select the curing temperature and curing time suitable for the production process, in order to achieve the best performance of the product formulation design;
If in an open high temperature environment such as heating plate/sleeve curing, it is necessary to appropriately
increase the curing temperature and extend the curing time; The single-cartridges matching needle is suitable for the continuous construction of the dispensing gun/machine, which can greatly improve production efficiency and reduce waste and pollution.
Storage and Packing：
Wellmid 2118 should be sealed and stored in a dry and cold environment of 3~6℃ When not in use, the longest effective time of the product can be more than 12 months; The expiry date is indicated on the label.
Package: 1oz(28.35Grems) / 1kg Tin can; 1oz(28.35Grems) / 310ml Syringe.
