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Description：
Wellmid 2119 is a one-component, high-temperature curing flowable epoxy adhesive with high strength and good toughness, which can be sealed and insulated, and can withstand high temperatures up to 120°C. Suitable for bonding metals, magnetic materials, composite materials and most common materials. It has good weather resistance, excellent water and chemical resistance, and good vibration resistance. Applications include structural bonding and insulation sealing of electronic components, copper wire coils, electrical assembly, equipment parts, motor magnetic assembly and other components.
Key properties：
● Tough adhesive with good dynamic load properties and shear and p eel strength
● One-component flowable adhesive, easy to operate
● Excellent resistance to most chemicals
● Can be bonded to most materials, good weather and water resis tance
● Low shrinkage, suitable for bonding and sealing of electronic industrial products
| Property | 2119 |
| Colour (visual) | Cream color |
| Specific gravity | 1.15 |
| Viscosity at 23-25℃ | 320~560 Pa.s |
| UV fixed time(23-25℃) | 7 days |
Pretreatment
The strength and durability of a bonded joint are dependant on proper treatment of the surfaces to be bonded. At the very least, joint surfaces should be cleaned with a good degreasing agent such as acetone, alcohol or other proprietary degreasing agents in order to remove all traces of oil, grease and dirt. The strongest and most durable joints are obtained by either mechanically abrading or chemically etching (“pickling”) the degreased surfaces. Abrading should be followed by a second degreasing treatment.
Application of adhesive
Wellmid 2119 should be sealed and stored in a dry and cold environment at 3~6℃ When it's not in use.
When using, the product should be placed at room temperature for 1-2 hours to restore the normal state of the glue before construction. Wellmid 2119 can be applied directly to the pretreated dry bonded surface through the mixer. A layer of 0.03-0.05mm thick adhesive layer can completely wet the adhesive surface, and give the adhesive with maximum shear strength. Too thick adhesive layer and too much glue around, can not bring greater bonding strength to the adhesion.
Equipment maintenance
All tools should be cleaned with hot water and soap before adhesives residues have had time to cure. The removal of cured residues is a difficult and time-consuming operation. If solvents such as acetone are used for cleaning, operatives should take the appropriate precautions and, in addition, avoid skin and eye contact. Used cartridges and mixers cannot be used again.
Curing Time and Temperature：
| Curing temperature | 120℃ | 140℃ | 160℃ | 180℃ | 200℃ | 220℃ |
| Cure time to reach 50% shear strength | 3H | 1H | 20min | 10min | 2min | 1min |
| Cure time to reach 100% shear strength | 6H | 2H | 40min | 20分钟 | 5min | 3min |
Wellmid 2119 cannot be cured at room temperature; prolonging the curing time below 120°C may harden the glue, but it cannot be completely cured and achieve the performance of the glue design; It is recommended to bake and cure at 140°C for 120 minutes;
Or refer to the above table to select the curing temperature and curing time suitable for the production process,so as to achieve the best performance of the formula design of this product; If curing in an open high-temperature environment such as a heating plate/sleeve, it is necessary to appropriately increase the curing temperature and prolong the curing time;
Syringe and needle is suitable for continuous construction of the dispensing gun / machine, which can greatly improve production efficiency and reduce waste and pollution.
Storage and Packing：
Wellmid 2120 should be sealed and stored in a dry and cold environment of 3~6℃ When not in use, the longest effective time of the product can be more than 12 months; The expiry date is indicated on the label.
Package : 1oz(28.35Grems) / 1kg Tin can; 1oz(28.35Grems) / 310ml Syringe.
